Broadcom Inc. and Tower Semiconductor announced on September 10, 2024, the production of Wi-Fi 7 RF front-end module (FEM) devices. These new devices are based on Tower’s advanced 300mm RFSOI technology, enabling fully integrated Wi-Fi FEMs on a single RFSOI die.
This innovative solution delivers superior performance and efficiency compared to existing non-SOI technologies, setting a new standard for advanced mobile applications. The FEMs are specifically tailored to meet the stringent size and power efficiency requirements for mobile Wi-Fi applications.
The highly integrated process reduces chip area despite the complexity of supporting new features and frequency bands. Integrating a power amplifier device into this technology eliminates additional signal loss between separate dies, while the high-resistivity SOI substrate enhances PA efficiency by supporting passive elements like inductors with a higher quality factor.
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