Broadcom Inc. announced on September 23, 2024, the general availability of its Sian™ 2, 200 Gbps per lane (200G/lane) PAM-4 DSP PHY. This new product features 200G/lane electrical and optical interfaces, augmenting the existing Sian DSP that supports 100 Gbps electrical and 200Gbps optical interfaces.
The Sian 2 DSPs enable pluggable modules with 200G/lane interfaces, which are foundational for connecting next-generation AI clusters. These products are optimized for 800G and 1.6T optical module platforms, delivering increased bandwidth with lower power consumption, reduced latency, and lower cost per bit to facilitate AI data center scale.
Broadcom is currently sampling the Sian 2 BCM8582X device to its early access customers and partners. This technology, combined with Broadcom’s 200G/lane optics, provides best-in-class performance and power consumption, allowing data center operators to cost-effectively scale AI workloads.
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