Corning Collaborates with Broadcom to Accelerate AI Data Center Processing Capacity with Co-Packaged Optics

AVGO
September 06, 2025
Corning Incorporated announced on May 13, 2025, a collaboration with Broadcom Inc. on a co-packaged optics (CPO) infrastructure designed to significantly increase processing capacity within data centers. Corning will supply cutting-edge optical components for Broadcom’s Bailly CPO system. The Bailly CPO system is recognized as the industry’s first CPO-based 51.2 terabit per second (TBps) Ethernet switch. This combination is expected to deliver substantial improvements in optical interconnection density and power savings, making it ideal for large-scale artificial intelligence (AI) clusters. Broadcom’s Bailly CPO system integrates eight silicon photonics-based, 6.4 TBps optical engines, which are co-packaged with Broadcom’s StrataXGS® Tomahawk®5 Ethernet switch chip. Corning is a qualified supplier of the necessary optical infrastructure, including fiber harnesses, connectors for front-plate and external laser modules, and fiber array units, ensuring high precision and reliability for these advanced AI deployments. The content on BeyondSPX is for informational purposes only and should not be construed as financial or investment advice. We are not financial advisors. Consult with a qualified professional before making any investment decisions. Any actions you take based on information from this site are solely at your own risk.