Arteris, Inc. announced the immediate availability of Magillem Packaging on June 23, 2025, a new software product designed to simplify and speed up the process of building advanced chips. This product addresses the challenge of assembling and reusing existing technology, which is a time-consuming part of complex chip design.
Magillem Packaging enables IP teams to quickly and reliably package and prepare hundreds or thousands of components for integration into a chiplet or SoC, including new, existing, or third-party IP blocks. It is based on the latest version of the IEEE 1685 (IP-XACT) standard, ensuring seamless compatibility with industry tools and silicon IP.
This new software builds on Arteris’ proven approach to design automation, complementing its broader suite of products used by top semiconductor companies. By streamlining IP readiness and assembly, Magillem Packaging boosts productivity and helps partners and customers deliver advanced technologies faster while reducing costly errors and delays.
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