Applied Materials, Inc. and CEA-Leti announced the next phase of their collaboration, planning to expand their joint lab to accelerate innovation in specialty semiconductors. This expanded initiative will focus on developing materials engineering solutions for emerging infrastructure challenges in AI data centers.
The joint lab, which targets ICAPS markets (IoT, Communications, Automotive, Power, and Sensors), will be equipped with new capabilities for full-flow development of specialty devices and advanced packaging tools. This aims to support heterogeneous integration of chips across different wafer types and process nodes, enabling new classes of energy-efficient devices.
This expansion extends Applied Materials' global EPIC Platform, designed to accelerate the commercialization of new chip technologies through high-velocity co-innovation. The collaboration is expected to strengthen the chipmaking ecosystem in France and foster breakthroughs in critical applications for the AI era.
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