Applied Materials, Inc. announced plans to expand its global EPIC innovation platform with a new collaboration model focused on accelerating the commercialization of advanced chip packaging technologies. This initiative aims to address the growing demand for energy-efficient computing driven by artificial intelligence (AI).
The company hosted a summit in Singapore, bringing together over two dozen R&D leaders from the semiconductor industry to foster alliances among equipment makers, material providers, device companies, and research institutes. This collaborative approach is designed to fast-track new technologies for next-generation computing.
The EPIC Advanced Packaging strategy will leverage Applied Materials' global innovation centers to drive progress in connecting multiple chips within a computing system. Construction of the flagship EPIC Center in Silicon Valley is on schedule, with operations expected to commence in Spring 2026, providing infrastructure to speed up R&D cycles.
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