Applied Materials, Inc. introduced its new SEMVision™ H20 system, a next-generation defect review solution designed to help leading semiconductor manufacturers advance chip scaling. This system integrates the industry's most sensitive electron beam (eBeam) technology with advanced AI image recognition for enhanced analysis of buried nanoscale defects in advanced chips.
The SEMVision™ H20 is critical for complex 3D architecture inflections required for manufacturing logic chips at the 2nm node and beyond, including new Gate-All-Around (GAA) transistors, as well as higher-density DRAM and 3D NAND memories. It delivers defect analysis results up to three times faster than previous advanced techniques.
Leading logic and memory chipmakers have already adopted the new SEMVision™ H20 defect review system for emerging technology nodes. This product launch reinforces Applied Materials' leadership in process diagnostics and control, enabling faster chip development and improved factory yields.
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