Applied Materials, Inc. announced on October 7, 2025 that it has launched three new semiconductor manufacturing systems— the Kinex Bonding System, the Centura Xtera Epi System, and the PROVision 10 eBeam Metrology System—designed to accelerate the production of advanced logic, memory, and packaging chips for AI applications.
The Kinex Bonding System is the industry’s first integrated die‑to‑wafer hybrid bonder, combining Applied Materials’ front‑end wafer processing with Besi’s die placement and interconnect expertise. It delivers higher bonding accuracy and speed, enabling customers to produce higher‑performance, lower‑power logic and memory chips while reducing manufacturing complexity and cost.
The Centura Xtera Epi System addresses the void‑free source‑drain deposition challenge in 2 nm and beyond GAA transistors. Its low‑volume chamber architecture, integrated pre‑clean and etch steps, and continuous trench‑opening adjustment achieve 50 % lower gas usage and a 40 % improvement in cell‑to‑cell uniformity, and it is already being adopted by leading logic and memory manufacturers.
The PROVision 10 eBeam Metrology System introduces cold field‑emission technology, providing up to 50 % higher imaging resolution and 10× faster throughput compared with conventional thermal field emission. It supports sub‑nanometer critical‑dimension metrology and overlay for 3‑D architectures, including GAA transistors, backside power delivery, next‑generation DRAM, and 3‑D NAND, and is in use by multiple top-tier customers.
These product launches position Applied Materials to capture the growing demand for AI‑centric chip manufacturing, enhance its integrated solutions portfolio, and strengthen its competitive advantage in the high‑growth logic, memory, and packaging markets.
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