On October 6, 2025, Amkor Technology held a ground‑breaking ceremony in Tempe, Arizona, to commence construction of a new semiconductor advanced packaging and test campus. The company announced that it has increased its investment in the project to $7 billion, underscoring its commitment to expanding capacity for advanced packaging solutions.
The new campus will focus on advanced packaging and test services, positioning Amkor to meet growing demand for high‑performance computing, AI, automotive, and IoT applications. By adding this facility, Amkor aims to enhance its global footprint and provide customers with additional capacity for complex, high‑volume packaging projects.
This expansion aligns with Amkor’s broader strategy of investing in advanced packaging capabilities and geographic diversification. The $7 billion investment represents a significant capital allocation that is expected to support the company’s long‑term growth trajectory and strengthen its competitive position in the OSAT market.
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