Amkor Technology announced a new advanced packaging partnership with Nvidia for next‑generation AI and data‑center processors, a key component of Nvidia’s strategy to secure domestic packaging solutions for its high‑performance chips.
During Nvidia’s investor conference call, Chief Financial Officer Colette Kress confirmed that Amkor and Siliconware Precision Industries Co will collaborate on domestic advanced packaging projects over the next four years, marking a major new customer win for Amkor and underscoring Nvidia’s onshoring push.
The deal expands Amkor’s presence in the high‑performance computing market, strengthens its computing segment, and aligns with its focus on high‑density fan‑out and 2.5D technologies—critical for integrating complex AI processors. It also supports Nvidia’s goal of building a resilient U.S. supply chain for AI chips.
Amkor’s Q3 2025 revenue reached $1.99 billion, a 31% sequential increase, with record revenue in Communications and Computing. The partnership is expected to further boost the computing mix and support future growth, building on the momentum from the recent quarter’s strong performance.
Amkor broke ground on a new Advanced Packaging and Test Campus in Arizona in October 2025, positioning the company to meet the increased demand from Nvidia and other AI customers. The new facility will enhance capacity for high‑density fan‑out and 2.5D packaging, directly supporting the partnership’s technical requirements.
Investors welcomed the announcement, noting the strategic significance of securing a key AI chip supplier and the potential for long‑term revenue growth.
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