Alpha and Omega Semiconductor Limited (AOSL) introduced the AOLV66935, a 100‑volt high‑safe‑operating‑area (SOA) MOSFET packaged in an LFPAK 8×8 format, designed for 48‑volt hot‑swap power supplies in AI servers. The device delivers a low on‑resistance of 1.86 mΩ at 10 V and can operate continuously up to 125 °C, meeting the thermal and power density demands of next‑generation data‑center workloads that rely on GPUs and TPUs.
The MOSFET incorporates AOSL’s AlphaSGT™ trench technology, which enables the 25 °C SOA rating and a 60 % reduction in package volume compared with the competing TO‑263 (D2PAK) format. The smaller footprint allows designers to fit more power devices on a single board, improving thermal management and reducing board real‑estate costs—critical factors for high‑density AI server chassis.
This launch is a key element of AOSL’s Power IC transformation strategy, which has driven a 37 % year‑over‑year increase in Power IC revenue and now accounts for nearly 40 % of total product revenue. By expanding its high‑performance power‑device portfolio, AOSL positions itself to capture higher‑margin segments within the AI and data‑center markets, where power efficiency and reliability are premium attributes.
Investors responded positively to the announcement, reflecting confidence in AOSL’s ability to capitalize on the accelerating AI server market. The new MOSFET strengthens the company’s competitive stance against larger rivals such as Infineon and Texas Instruments by offering advanced performance in a compact form factor that aligns with the industry’s shift toward tighter, more efficient power solutions.
The product’s specifications—low on‑resistance, high SOA, and robust 125 °C operation—address the core pain points of AI server designers: minimizing power loss, ensuring reliability under sustained high temperatures, and enabling higher power density without increasing board size. These capabilities are expected to drive demand for the AOLV66935 as data‑center operators upgrade or expand their AI infrastructure.
AOSL’s broader strategy includes investing in research and development to further improve trench technology and exploring new packaging solutions that can support even higher voltages and current ratings. The company’s focus on high‑margin power ICs signals a shift from legacy analog components toward more profitable, high‑growth segments, which is expected to sustain revenue growth and improve profitability over the next few years.
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