ASML announced its participation in a three-year development project alongside partners, including Infinitesima, to further enhance the capabilities of the Metron3D 300 mm in-line wafer metrology system. This collaboration aims to optimize metrology solutions for cutting-edge applications.
The project will focus on critical areas such as hybrid bonding, high-NA EUV lithography, and advanced 3D logic device structures like complementary field-effect transistors (CFETs). This initiative highlights ASML's commitment to advancing the entire semiconductor manufacturing ecosystem.
By combining extensive expertise, the project seeks to develop more precise and efficient metrology solutions, which are essential for improving yields and performance in the production of next-generation microchips.
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