Broadcom Inc.'s silicon division announced the launch of its next-generation Jericho networking chip. This new chip is specifically designed to advance artificial intelligence (AI) data center networks.
The Jericho chip is engineered to connect data centers over long distances, specifically more than 60 miles (96.5 km) apart, while also accelerating AI computation. This capability is crucial for distributed AI workloads and large-scale data processing.
This product launch enhances Broadcom's portfolio of high-performance networking solutions for AI infrastructure. It addresses the growing demand for efficient and scalable connectivity in the evolving landscape of AI data centers.
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