Corning Partners with Broadcom to Advance Co-Packaged Optics Infrastructure for AI Data Centers

AVGO
September 20, 2025
Corning Incorporated announced a collaboration with Broadcom Inc. to develop a co-packaged optics (CPO) infrastructure aimed at significantly increasing processing capacity within data centers. Corning will supply optical components for Broadcom’s Bailly CPO system. Broadcom’s Bailly CPO system is described as the industry’s first CPO-based 51.2 terabit per second (TBps) Ethernet switch. This integrated solution is designed to deliver substantial improvements in optical interconnection density and power savings, making it ideal for large-scale artificial intelligence (AI) clusters. The collaboration focuses on placing optics and electronics closer together in a processing system to improve networking and processing bandwidth, density, and power efficiency. This partnership strengthens Broadcom's offerings for next-generation AI-powered data centers, including future 200G per lane CPO solutions. The content on BeyondSPX is for informational purposes only and should not be construed as financial or investment advice. We are not financial advisors. Consult with a qualified professional before making any investment decisions. Any actions you take based on information from this site are solely at your own risk.