OpenAI Partners with Broadcom and TSMC to Develop First In-House AI Chip

AVGO
September 20, 2025
OpenAI is reportedly collaborating with Broadcom and Taiwan Semiconductor Manufacturing Co (TSMC) to develop its first server chip specifically designed for artificial intelligence. This strategic move aims to support OpenAI's rapidly expanding AI systems. The partnership indicates OpenAI's decision to focus on in-house chip design rather than establishing its own chip manufacturing foundries. Sources familiar with the matter suggest the custom AI chip could arrive as early as 2026. This collaboration positions Broadcom as a key partner for a leading AI company, validating its expertise in custom AI accelerators (XPUs). The news also highlights OpenAI's efforts to diversify its chip supply and reduce reliance on a single vendor, while also incorporating AMD chips alongside Nvidia's. The content on BeyondSPX is for informational purposes only and should not be construed as financial or investment advice. We are not financial advisors. Consult with a qualified professional before making any investment decisions. Any actions you take based on information from this site are solely at your own risk.