Tria Technologies, an Avnet company specializing in embedded compute boards, announced on March 4, 2025, the launch of five new product families. These new offerings, powered by Qualcomm Dragonwing and Snapdragon platforms, will debut at Embedded World 2025, scheduled for March 11-13 in Nuremberg, Germany.
The new embedded modules are designed to address a wide range of low- to high-end applications, focusing on power conservation, performance upgrades, and delivering AI capabilities for challenging environments. Products include the Tria IQ-9075 Vision AI-KIT, Tria SMARC QCS6490, Tria SMARC QCS5430, Tria IQ-615 (OSM and SMARC), and Snapdragon X Elite (Com Express and Com HPC).
These modules, designed and manufactured in Germany, aim to empower industrial customers to advance AI deployment at the edge. This expansion of Tria's technology portfolio strengthens Avnet's position in the high-growth embedded solutions market and its strategic partnership with Qualcomm Technologies.
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