Bruker Corporation announced on June 24, 2025, the shipment and installation of its 15th InSight WLI 3D optical metrology system to a leading semiconductor manufacturer. This installation is part of a larger order for 27 Bruker optical metrology systems in 2025.
This reflects the growing demand for high-performance metrology solutions that support advanced packaging requirements in the latest generation of AI high-performance chip manufacturing processes. Advanced packaging, which integrates multiple chips into a single, compact package, is crucial for AI workloads requiring high bandwidth and low latency.
Bruker’s InSight WLI system is specifically designed for these advanced packaging measurement requirements, providing non-contact, high-resolution 3D optical metrology. It accurately measures layer-to-layer alignment, surface topography, and coplanarity, which are essential for maintaining yield and quality in semiconductor manufacturing.
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