Ceva Secures Key Automotive IP Deal with NXP Semiconductors at CES 2026

CEVA
January 07, 2026

Ceva, Inc. announced on January 6, 2026 that its SensPro AI DSP architecture will be embedded in NXP Semiconductors’ S32Z2 and S32E2 real‑time processors. The integration, revealed at CES 2026 in Las Vegas, targets software‑defined vehicle platforms and equips them with predictive analytics, energy‑management, and real‑time control capabilities.

The software‑defined vehicle (SDV) market is projected to grow from roughly $200 billion in 2024 to over $1.2 trillion by 2030, with a compound annual growth rate of 30‑35 %. Ceva’s partnership with NXP positions the company at the heart of this expansion, as the SensPro DSP can process vision, radar, and AI inference in a single, power‑efficient core that meets the stringent safety and latency requirements of advanced driver‑assist and autonomous systems.

For Ceva, the deal marks a pivotal shift from a connectivity‑IP focus to a broader AI‑platform strategy. The embedded DSP will generate recurring royalty revenue as NXP’s processors move into production, while also enabling cross‑sell opportunities with Ceva’s existing sensor‑fusion and connectivity IP. The partnership signals that Ceva’s technology is now a core component of automotive silicon stacks, potentially accelerating its revenue growth in the high‑margin automotive segment.

NXP benefits by augmenting its automotive portfolio with a proven AI inference engine that delivers higher performance per watt and deterministic safety‑critical inference. The integration aligns with NXP’s strategy to bring AI to the automotive edge, and it strengthens the company’s position as a leading supplier of software‑defined vehicle silicon. The partnership also supports NXP’s goal of doubling its automotive revenue from $1 billion in 2024 to $2 billion by 2027.

Ceva CEO Amir Panush said, “As vehicles become increasingly connected and intelligent, the ability to process sensor data and apply AI in real time is critical.” NXP’s VP and GM of Automotive Processors, Robert Moran, added, “By integrating Ceva’s AI DSP, we deliver the machine‑learning and AI capabilities our customers need to accelerate innovation in real‑time compute applications for software‑defined vehicles.”

Investors reacted positively to the announcement, viewing the design win as a validation of Ceva’s technology and a boost to its automotive IP pipeline. The partnership is expected to enhance both companies’ competitive positioning in the rapidly growing SDV market, reinforcing their long‑term growth prospects.

The content on BeyondSPX is for informational purposes only and should not be construed as financial or investment advice. We are not financial advisors. Consult with a qualified professional before making any investment decisions. Any actions you take based on information from this site are solely at your own risk.