Digi International Joins T-Mobile Partner Plus Channel Subsidy Program

DGII
October 05, 2025

Digi International announced on October 16, 2024, that it has joined the T-Mobile Partner Plus Channel Subsidy Program. This collaboration is designed to expand Digi's channel presence and enhance its ability to deliver IoT solutions to a broader customer base.

The program participation is expected to provide new avenues for sales and adoption of Digi's connectivity products and services. This strategic move aligns with the company's efforts to strengthen its market position through partnerships.

By integrating with T-Mobile's channel, Digi aims to simplify the deployment and management of secure, high-speed connectivity for various organizations. This initiative supports the company's overall strategy to grow its footprint in the Internet of Things market.

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