GlobalFoundries announced on May 20, 2025, a new Memorandum of Understanding (MOU) with Singapore’s Agency for Science, Technology and Research (A*STAR) to expand its advanced packaging capabilities. This collaboration aims to accelerate innovation in advanced packaging technologies, a key priority for the semiconductor industry.
Under the MOU, A*STAR will provide access to its R&D facilities and technical support, while GlobalFoundries will supply critical equipment to further R&D efforts. This partnership will accelerate GF’s plans to develop and ramp advanced packaging solutions, offering customers one-stop solutions for chip manufacturing, processing, packaging, and testing at its Singapore facility.
This initiative aligns with GlobalFoundries' global advanced packaging roadmap and complements its previously announced New York Advanced Packaging and Photonics Center. It also includes skills enhancement initiatives for GF employees, fostering talent development in advanced packaging.
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