Laser Photonics Corporation announced on December 3, 2024, the expansion of its product offering targeting the surging market for chip fabrication. This expansion is supported by its recently acquired subsidiary, Control Micro Systems, Inc. (CMS).
The expanded product line includes the BlackStar laser wafer dicing and scribing system, engineered with short-pulse laser technology for minimal heat and improved die yield. It also features custom-tailored multi-station laser systems for wafer marking, scribing, and lapping, with robotic wafer positioning and machine vision.
A chip marking system integrating ultraviolet laser technology has also been added, allowing for the smallest permanent chip markings without microstructural damage. This strategic move aims to accelerate semiconductor manufacturing and contribute to growing shareholder value in a market projected to reach $1 trillion annually by 2030.
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