Laser Photonics Corporation, along with its recently acquired subsidiary Control Micro Systems, Inc. (CMS Laser), announced on February 4, 2025, the expansion of their Laser Wafer Marking technology research and development program. This initiative aims to deliver advanced equipment to support the growth of U.S. chip manufacturing.
High-precision Laser Wafer Marking technologies are designed for engraving serial numbers and other critical information on silicon and compounds used in the semiconductor industry. CMS Laser's technology offers custom configurations for each client, including laser type, product transport, machine vision, and fume extraction.
These systems deliver unrivaled performance, enhancing production with precision, speed, and adaptability for chip manufacturers. This R&D focus leverages CMS Laser’s specialized expertise, aligning with Laser Photonics' broad diversification strategy to boost shareholder value and strengthen market resilience.
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