Lantronix Inc. announced five new System-in-Package (SiP) solutions on October 9, 2024, powered by Qualcomm Technologies’ chipsets. These new SiP families are designed to bring advanced Artificial Intelligence (AI) and Machine Learning (ML) capabilities to the network edge.
The new SiP modules are expected to accelerate the development of AI-driven applications in industrial and enterprise use cases, including robotics, industrial automation, video surveillance, video collaboration, and drones. These solutions integrate AI capabilities from the Qualcomm AI Hub, providing a reference base of over 100 AI models.
The new offerings include the IQ9 Series SiPs for industrial and robotics applications, the Open-Q 8550 CS for advanced video and AI applications, and the Open-Q 6490CS and 5430CS for scalable AI solutions. These products are compliant with the Trade Agreements Act (TAA) and the National Defense Authorization Act (NDAA).
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