Lantronix Powers Next-Generation AI-Enabled Camera Solutions With Seamless Teledyne FLIR Thermal Integration

LTRX
September 19, 2025
Lantronix Inc. announced a breakthrough in AI-powered camera technology on March 4, 2025, with the seamless integration of its high-performance Open-Q System-on-Module (SoM) solutions with Teledyne FLIR’s thermal cameras. This integration enables advanced AI-enabled camera solutions. The collaboration targets autonomous navigation in drones, robotics, and surveillance applications, providing enhanced visual navigation and real-time intelligence at the edge. Lantronix’s Open-Q SoMs deliver advanced Edge AI processing capabilities for these next-generation solutions. This development leverages Lantronix's expertise in embedded compute technology and software, combined with Teledyne FLIR's thermal imaging. The integrated solutions are designed to meet the growing demand for intelligent, connected devices in various industrial and defense sectors. The content on BeyondSPX is for informational purposes only and should not be construed as financial or investment advice. We are not financial advisors. Consult with a qualified professional before making any investment decisions. Any actions you take based on information from this site are solely at your own risk.