3M has joined JOINT3, a next-generation semiconductor packaging consortium established by Japan-based Resonac Corporation. This initiative brings together global leaders in semiconductor materials, equipment, and design to accelerate the development of tools optimized for panel-level organic interposers.
Panel-level organic interposers are critical for 2.xD packages, which are seeing increased demand in rapidly expanding markets such as generative AI and autonomous vehicles. These interposers are essential for driving device performance and systems innovation in advanced semiconductors.
3M will contribute its decades of materials science expertise and key technology platforms to the consortium. This participation underscores 3M's commitment to shaping the future of advanced packaging and driving progress in semiconductor manufacturing and roadmap advancement.
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