Micron Technology commenced construction on a new High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, adjacent to its existing operations. This significant investment, totaling approximately US $7 billion (SG$9.5 billion) through the end of the decade, is aimed at meeting the escalating demand for AI-driven memory chips.
The new facility, which is Singapore’s first of its kind for HBM advanced packaging, is scheduled to begin operations in 2026. It is expected to meaningfully expand Micron’s total advanced packaging capacity starting in calendar 2027, directly supporting the robust growth in artificial intelligence.
This strategic expansion will initially create around 1,400 jobs in packaging development, assembly, and test operations, with plans to reach an estimated 3,000 jobs in the future. The facility will incorporate advanced sustainability features, including greenhouse gas abatement, water recycling, and AI-based intelligent automation, aligning with LEED certification requirements.
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