On Oct 22, 2025, Micron announced customer sampling of its 192GB SOCAMM2 module, the highest‑capacity SOCAMM2 to date. Built on the company’s 1‑gamma DRAM process, the module delivers 50 % more capacity and over 20 % improvement in power efficiency compared with the previous SOCAMM generation.
The new module supports speeds up to 9.6 Gbps and is engineered for AI data‑center workloads, reducing time‑to‑first‑token by more than 80 % in real‑time inference. It is part of Micron’s partnership with NVIDIA and is designed to enable larger, more energy‑efficient AI clusters.
Micron plans to ship customer samples now and align high‑volume production with launch schedules, positioning the product to capture a growing market for low‑power, high‑capacity memory in AI servers. The launch underscores Micron’s continued focus on advanced memory solutions that drive AI performance and power efficiency.
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