ON Semiconductor announced on October 28, 2025, that Teledyne Technologies has selected its Treo platform for developing next-generation readout integrated circuit (ROIC) application-specific integrated circuits (ASICs). These ASICs are intended for advanced infrared imaging systems.
The Treo platform, built on an advanced 65nm node, features a modular architecture and a rich set of IP building blocks. This design helps to speed up development and reduce time-to-market for complex imaging solutions.
This collaboration positions ON Semiconductor's Treo platform in high-value markets such as aerospace, defense, security, and scientific applications, where infrared imaging systems are essential. The selection by Teledyne validates the platform's capabilities for mission-critical designs requiring high performance and efficiency in extreme environments.
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