Hyundai Mobis and Qualcomm Technologies Inc. signed a memorandum of understanding on January 7, 2026 at CES Las Vegas to jointly develop next‑generation software‑defined vehicle (SDV) and advanced driver‑assist systems (ADAS) solutions.
The partnership will combine Hyundai Mobis’s expertise in system integration, sensor fusion and perception with Qualcomm’s Snapdragon Ride Flex system‑on‑chip (SoC), a platform designed to run mixed‑critical cockpit and safety workloads on a single chip. The co‑development effort targets emerging markets, with India identified as a key early‑adoption region, while the solution will be scalable for other high‑growth markets such as Southeast Asia and Latin America.
For Qualcomm, the deal is a material customer win that adds a multi‑year revenue stream and supports the company’s goal of $8 billion in automotive revenue by FY29. For Hyundai Mobis, the agreement reinforces its future‑mobility strategy, which aims to raise its global OEM component share to 40% by 2033 and to accelerate its SDV and ADAS capabilities.
The collaboration positions Qualcomm against competitors such as NVIDIA, Intel and Bosch by providing a unified digital chassis that integrates connectivity, cockpit and safety functions. Hyundai Mobis benefits from Qualcomm’s advanced SoC technology, while Qualcomm gains a proven automotive systems integrator to accelerate market penetration.
"We are excited to partner with Hyundai Mobis to bring cutting‑edge SDV and ADAS solutions to emerging markets," said Nakul Duggal, President of Automotive, Industrial and IoT at Qualcomm. "This partnership accelerates our Snapdragon Digital Chassis strategy and brings us closer to our $8 billion automotive revenue target." “Hyundai Mobis is a leader in automotive electronics, and this collaboration will help us deliver scalable, cost‑effective solutions to customers worldwide,” added Jung Soo‑Kyung, Executive Vice President of Hyundai Mobis Automotive Electronics.
The agreement underscores the growing convergence of consumer electronics and automotive technology and signals a shift toward software‑centric vehicles. By aligning a leading semiconductor supplier with a top automotive systems integrator, the deal is poised to accelerate the adoption of SDV and ADAS in high‑growth markets and strengthen both companies’ competitive positions in the evolving connected‑vehicle ecosystem.
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