Rambus Inc. announced the availability of industry-first complete memory interface chipsets for next-generation DDR5 Multiplexed Rank Dual Inline Memory Modules (MRDIMMs) and Gen5 DDR5 RDIMMs. These chipsets are designed to deliver breakthrough performance for data center and AI applications, addressing the increasing demand for higher bandwidth and capacity in high-performance computing.
The MRDIMM 12800 chipset, for which Rambus was first to market with a complete solution, represents a significant technological leap and market expansion opportunity. This technology is designed to intercept future server platforms, with revenue expected to ramp in the second half of 2026, and it employs a novel architecture that effectively doubles bandwidth and capacity.
The new MRDIMM solution requires specialized chips, including one Multiplexing RCD (MRCD) and ten Multiplexing Data Buffers (MDBs) per module, along with a second-generation PMIC. This translates to at least four times the content per module compared to current RDIMMs, directly boosting Rambus's revenue potential per server slot. The RDIMM 8000, also part of this next wave, utilizes the Gen-5 RCD and a new server PMIC to deliver over 67% greater bandwidth compared to the first generation of DDR5.
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