Tower Semiconductor and Xscape Photonics announced the successful prototyping and validation kit availability of the industry’s first on-chip, optically pumped, multi-wavelength laser source. Built on Tower’s mature, high-volume PH18 Silicon Photonics platform, this solution supports CWDM and DWDM wavelength grids. It is specifically tailored for AI datacenter fabrics, where bandwidth density, power efficiency, and scalability are essential.
This breakthrough enables a path toward high performance, high reliability, lower cost, and a simplified supply chain by monolithically embedding programmable multi-color lasers directly on-chip, optically pumped by a single CW external laser. It eliminates the need for multiple externally modulated lasers or complex hybrid III-V integration, simplifying design, reducing latency, and lowering component count. This is particularly impactful for GPU-to-GPU and GPU-to-HBM optical links in AI clusters.
The optical interconnect market for AI datacenters is projected to experience significant growth, with LightCounting forecasting sales of optical transceivers and LPO/CPO for AI clusters to exceed $10 billion in 2026, doubling 2024 sales, and further growing to $20 billion by 2030. Ed Preisler, Vice President and GM of Tower Semiconductor’s RF Business Unit, stated that this new solution exemplifies how their flexible, modular technology ecosystem enables rapid prototyping and high-volume production adoption for emerging AI and data-driven markets.
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