UMC announced a licensing agreement with imec to transfer the iSiPP300 silicon photonics process to its 12‑inch fabs, enabling co‑packaged optics (CPO) compatibility and higher‑bandwidth interconnects for data‑center and telecom customers.
The iSiPP300 platform incorporates microring‑based filters, modulators, GeSi electro‑absorption modulators, and fiber interfaces, built on advanced CMOS processing. The technology is designed for 12‑inch wafers, allowing UMC to scale production and reduce per‑chip cost.
UMC plans to begin risk production in 2026, with full‑scale production slated for 2027. The partnership positions UMC to capture a growing silicon photonics market projected to reach $4.8 billion by 2034, and to compete with TSMC and Samsung in high‑margin advanced nodes.
Senior Vice President GC Hung said the deal will accelerate UMC’s photonic platform readiness on 12‑inch wafers and that the company is already engaging new customers for optical transceiver applications. imec’s Vice‑President Philippe Absil highlighted the collaborative approach to bring silicon photonics solutions to market.
The licensing agreement expands UMC’s silicon photonics portfolio beyond its traditional mature‑node focus, allowing it to offer higher‑value, higher‑margin products and to strengthen its position as a specialty foundry in the rapidly expanding high‑bandwidth connectivity space.
UMC currently holds a 6% share of the global foundry market, trailing TSMC and Samsung. The new silicon photonics capability is expected to broaden its customer base and enhance its competitive edge in advanced technology segments.
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