At Computex 2025 on May 19, 2025, Western Digital announced advancements in ecosystem collaboration and innovation for AI/ML, disaggregated storage, and software-defined storage (SDS). The company is expanding its Open Composable Compatibility Lab (OCCL) to accelerate industry-wide interoperability for fabric-attached devices.
Key enhancements to OCCL 2.0 include testing across disaggregated compute, storage, and networking to help customers scale more efficiently and reduce costs. The lab's growing list of ecosystem participants includes Arista Networks, Broadcom, DapuStor, Graid Technology Inc., Ingrasys, Intel, Kioxia, MinIO, NVIDIA, OSNexus, PEAK:AIO, Phison, SanDisk, ScaleFlux, ThinkParQ Gmbh/BeeGFS, and Xinnor.
Western Digital also introduced new product enhancements, including the OpenFlex Data24 4100 EBOF for cloud-like environments and the Ultrastar Data102 3000 ORv3 JBOD, designed to meet Open Compute Project (OCP) specifications for improved power efficiency and airflow. The Platforms Business now offers enhanced flexibility by qualifying SSDs from multiple vendors, including DapuStor, Kioxia, Phison, SanDisk, and ScaleFlux.
The content on BeyondSPX is for informational purposes only and should not be construed as financial or investment advice. We are not financial advisors. Consult with a qualified professional before making any investment decisions. Any actions you take based on information from this site are solely at your own risk.