Wolfspeed announced that it has successfully grown a single‑crystal 300‑mm (12‑inch) silicon carbide wafer, the first time the company has reached this diameter. The breakthrough expands the firm’s manufacturing platform beyond its existing 200‑mm line and is expected to lower unit costs and improve yields for high‑voltage power devices and advanced photonic products.
The larger wafer size increases the number of chips that can be produced per wafer by roughly 2.25 times, spreading fixed capital and tooling costs across more dies. Wolfspeed’s management explained that the move will enable the company to scale production of silicon‑carbide modules for AI data‑center power supplies, augmented‑reality/virtual‑reality headsets, and next‑generation electric‑vehicle power modules, all of which demand high‑voltage, high‑efficiency components.
Wolfspeed’s financial performance in the most recent quarter reflected the company’s ongoing restructuring. The firm reported a net loss of $1.2 billion and a gross margin of –12 % for the quarter, driven by high capital expenditures and under‑utilization of its 200‑mm fab. The 300‑mm breakthrough is positioned as a key lever to reverse this trend by reducing per‑die costs and improving throughput, thereby improving margin profiles in the medium term.
Chief Technology Officer Elif Balkas highlighted that the wafer production milestone is a “significant technology achievement” that will support the industry’s most transformative applications. She noted that the new platform will allow Wolfspeed to capture higher‑margin markets and accelerate commercialization of its 200‑mm products, reinforcing the company’s leadership in silicon‑carbide technology.
The announcement comes after Wolfspeed completed a Chapter 11 reorganization in late 2025, during which it cut debt and streamlined operations. Management emphasized that the 300‑mm capability is a strategic investment to regain profitability, with expectations that the new platform will drive revenue growth in high‑growth segments such as AI infrastructure and electric‑vehicle power electronics.
Overall, the 300‑mm wafer breakthrough represents a pivotal step for Wolfspeed, providing a competitive edge in cost and scale that could reshape its long‑term financial trajectory and market positioning.
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