Connectivity ICs
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All Stocks (30)
| Company | Market Cap | Price |
|---|---|---|
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AVGO
Broadcom Inc.
Broadcom supplies connectivity ICs and related components that enable data-center networking and telecom connectivity.
|
$1.60T |
$377.79
+11.05%
|
|
QCOM
QUALCOMM Incorporated
Modems and wireless connectivity integrated in Snapdragon drive Qualcomm's connectivity IC portfolio.
|
$176.20B |
$166.09
+1.71%
|
|
TXN
Texas Instruments Incorporated
TI offers connectivity ICs and wireless/bus interface solutions as part of its product lineup.
|
$144.92B |
$161.42
+1.27%
|
|
MRVL
Marvell Technology, Inc.
SerDes and high-speed interconnects/shaping interfaces fall under connectivity ICs.
|
$66.78B |
$83.31
+7.56%
|
|
NXPI
NXP Semiconductors N.V.
Connectivity ICs: NXP provides wireless connectivity controllers and related silicon for automotive and IoT.
|
$48.24B |
$190.52
-0.43%
|
|
MCHP
Microchip Technology Incorporated
Connectivity ICs cover Ethernet/communication interfaces and related components used in embedded and data-center contexts.
|
$27.47B |
$51.02
+0.24%
|
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ALAB
Astera Labs Inc
Connectivity ICs for PCIe/CXL and memory interconnects.
|
$23.57B |
$146.70
+3.46%
|
|
CRDO
Credo Technology Group Holding Ltd
Credo's products include connectivity ICs and interfaces for high-speed data paths.
|
$22.91B |
$148.52
+11.26%
|
|
STM
STMicroelectronics N.V.
Connectivity ICs including UWB capabilities support automotive and IoT connectivity.
|
$19.81B |
$22.06
+0.41%
|
|
TSEM
Tower Semiconductor Ltd.
Connectivity ICs reflect Tower's role in RF/optical interconnects and data-center communications.
|
$10.42B |
$95.59
+2.07%
|
|
SWKS
Skyworks Solutions, Inc.
Skyworks provides connectivity ICs and RF front-end components used in wireless devices and ecosystems.
|
$9.29B |
$63.23
+0.99%
|
|
LSCC
Lattice Semiconductor Corporation
Connectivity IC capabilities and integration within programmable solutions.
|
$9.21B |
$68.19
+1.38%
|
|
QRVO
Qorvo, Inc.
Connectivity ICs cover the RF/wireless connectivity components that Qorvo designs and supplies.
|
$7.57B |
$82.60
+1.11%
|
|
SMTC
Semtech Corporation
Connectivity ICs and wireless connectivity solutions align with Semtech's LoRa and broader data-center/wireless connectivity offerings.
|
$5.53B |
$69.20
+8.38%
|
|
PI
Impinj, Inc.
Endpoint ICs include wireless connectivity capabilities, aligning with Connectivity ICs.
|
$4.47B |
$157.89
+2.81%
|
|
SLAB
Silicon Laboratories Inc.
Company's products support multi-protocol wireless connectivity (Bluetooth, Thread, Matter), a core connectivity capability.
|
$3.97B |
$121.10
+0.15%
|
|
SYNA
Synaptics Incorporated
Core IoT connectivity chips including Wi-Fi, UWB IP, and GNSS front-end modules.
|
$2.44B |
$65.17
+3.16%
|
|
DIOD
Diodes Incorporated
Connectivity ICs tag reflecting PCIe-related interfaces and high-speed data communication components.
|
$2.08B |
$45.32
+1.30%
|
|
BELFB
Bel Fuse Inc.
Connectivity ICs capture Bel's focus on connectivity solutions and related modules used in harsh environments.
|
$1.53B |
$144.86
+2.77%
|
|
CTS
CTS Corporation
CTS refers to connectivity components in its diversified offerings, aligning with Connectivity ICs.
|
$1.23B |
$42.02
+0.51%
|
|
MXL
MaxLinear, Inc.
Connectivity ICs including Wi-Fi 7 single-chip platforms and Ethernet PHYs used in networking hardware.
|
$1.18B |
$14.74
+8.38%
|
|
INDI
indie Semiconductor, Inc.
Connectivity ICs for in-vehicle networks and sensor connectivity are relevant.
|
$711.21M |
$3.40
+3.50%
|
|
ECX
ECARX Holdings, Inc.
Connectivity ICs as part of the automotive in-vehicle communication ecosystem.
|
$570.20M |
$1.77
+5.03%
|
|
CEVA
CEVA, Inc.
CEVA's wireless IP portfolio includes Wi-Fi/Bluetooth/UWB, supported by Wi-Fi 6/7 royalty momentum, aligning with Connectivity ICs.
|
$453.76M |
$19.80
+4.18%
|
|
VLN
Valens Semiconductor Ltd.
VA7000/MIPI A-PHY family are connectivity ICs enabling high-bandwidth data transmission over long distances.
|
$159.15M |
$1.56
+4.33%
|
|
GCTS
GCT Semiconductor Holding, Inc.
Products include wireless connectivity ICs/modems embedded in devices (e.g., 5G/4G connectivity).
|
$73.18M |
$1.32
+1.15%
|
|
MOBX
Mobix Labs, Inc.
Connectivity ICs and related RF/wireless architecture components are part of the portfolio.
|
$24.50M |
$0.44
-4.55%
|
|
GUER
Guerrilla RF, Inc.
GUER develops RF connectivity ICs as part of its MMIC offerings, fitting Connectivity ICs.
|
$17.77M |
$1.68
|
|
SQNS
Sequans Communications S.A.
ACP-derived RF transceiver chips and 5G connectivity components are direct product offerings (connectivity ICs).
|
$13.67M |
$5.64
+3.11%
|
|
PRSO
Peraso Inc.
Design and sale of mmWave connectivity ICs and modules (e.g., PERSPECTUS and PRM2141X-D) directly produced by Peraso.
|
$5.48M |
$0.86
-2.48%
|
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# Executive Summary
* The Connectivity ICs industry is being fundamentally reshaped by the explosive demand for AI infrastructure, creating a stark divide between high-growth, AI-focused players and the broader market.
* While AI provides a powerful tailwind, many companies are still navigating a severe, ongoing inventory correction that has sharply impacted revenues and profitability in consumer and industrial markets.
* Heightened geopolitical tensions, including tariffs and antitrust scrutiny, are introducing significant risks, forcing costly supply chain adjustments and threatening strategic mergers and acquisitions.
* Secular growth in automotive, driven by vehicle digitalization and advanced driver-assistance systems (ADAS), provides a durable, high-content growth opportunity for specialized suppliers.
* Financial performance is bifurcated: AI-enablers are posting triple-digit growth and strong margins, while others are focused on operational efficiency and recovery.
* Strategic mergers and acquisitions remain a key tool for acquiring critical technology, particularly in the automotive and intelligent edge segments.
## Key Trends & Outlook
The primary catalyst reshaping the Connectivity ICs landscape is the unprecedented investment in AI infrastructure for both data centers and edge computing. This demand for high-speed, low-latency connectivity is fueling triple-digit revenue growth for pure-play enablers like Astera Labs, which saw a 104% year-over-year increase in Q3 2025, driven by its Intelligent Connectivity Platform for AI. The mechanism for value creation is the need for specialized solutions like custom AI silicon, optical interconnects, and PCIe/CXL retimers, which command premium prices. Larger players like Broadcom are also benefiting immensely, with AI semiconductor revenue expected to sustain strong growth into fiscal 2026, reaching $5.1 billion in Q3 2025. This trend is an immediate and powerful driver of valuations and strategic focus across the industry.
In stark contrast to the AI boom, much of the industry is emerging from a deep cyclical downturn caused by significant inventory digestion. This correction led to severe revenue declines, exemplified by Microchip Technology's 42.3% year-over-year sales drop in fiscal 2025 due to customers working through excess inventory. While some companies like NXP Semiconductors and STMicroelectronics are now reporting clear signals of a bottoming and recovery in their automotive and industrial segments, the lingering softness highlights the industry's inherent volatility.
Beyond AI, the most significant secular growth opportunity lies in the increasing semiconductor content in vehicles, driven by ADAS and electrification, where players like Qualcomm are seeing nearly 60% year-over-year growth in its Automotive segment, reaching $959 million in Q2 FY25. The primary risk stems from geopolitical and trade policy uncertainty, with active antitrust investigations into major players like Qualcomm in China and the UK, and direct tariff impacts forcing companies like Valens Semiconductor to revise revenue guidance downward to $66 million to $71 million for full-year 2025.
## Competitive Landscape
The Connectivity ICs market is intensely competitive, yet it features pockets of high concentration, particularly in specialized niches. For instance, Impinj captured 85% of the industry's 2024 unit volume growth in RAIN RFID, while Tower Semiconductor holds approximately 80% market share in silicon photonics foundry services.
One distinct competitive approach is that of **pure-play enablers of AI and data center infrastructure**. These companies, often fabless, hyper-focus on developing purpose-built, high-speed connectivity solutions that address critical bottlenecks in AI clusters. Astera Labs exemplifies this strategy, with its entire portfolio, including Aries PCIe 6 retimers and Scorpio X-Series switches, designed for cloud and AI infrastructure, leading to its industry-first PCIe 6 retimers ramping in high volume. This specialization allows for explosive growth and technology leadership in a specific niche, though it carries the vulnerability of high customer concentration and dependency on a single end-market.
In contrast, **diversified leaders with broad technology platforms** leverage a vast portfolio of intellectual property and products across multiple end-markets such as automotive, industrial, mobile, and IoT. Qualcomm, for example, adapts its Snapdragon platforms for mobile, PC, automotive (Digital Chassis), and IoT, demonstrating a strategy to be a "connected computing" leader across all intelligent devices. This approach offers revenue diversification and resilience against downturns in any single market, enabling significant research and development investment, but can result in slower overall growth compared to pure-plays and exposure to broader macroeconomic headwinds.
A third model involves **niche leaders commercializing proprietary standards and IP**. These companies develop and champion a specific technology or standard to become the indispensable solution for a particular application, thereby creating a strong competitive moat. Valens Semiconductor is a prime example, having built its business on the HDBaseT standard for Pro AV and now pioneering the MIPI A-PHY standard for automotive ADAS. Its VA7000 chipset is the first to comply with the MIPI A-PHY standard, leveraging its technology's superior interference immunity for high-bandwidth, resilient connectivity. While this strategy can lead to dominant market share and strong pricing power within their niche, the addressable market can be limited. Strategic mergers and acquisitions, such as NXP Semiconductors' multiple acquisitions in 2025, are also a key dynamic used by diversified players to acquire the technologies needed to compete with niche leaders and bolster their platform offerings.
## Financial Performance
Revenue growth in the Connectivity ICs industry exhibits a sharp bifurcation. This dramatic split is starkly illustrated by comparing Astera Labs' 104% year-over-year growth in Q3 2025, fueled by demand for its AI connectivity solutions, with Microchip Technology's 42.3% year-over-year decline in net sales for fiscal year 2025, a direct consequence of the broad-based inventory correction. The industry's growth is almost entirely driven by exposure to the AI infrastructure buildout, while companies tied to broader industrial and consumer markets have suffered from a severe inventory correction.
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Profitability diverges based on business model and market exposure. Gross margins range significantly, with IP-centric companies like CEVA achieving non-GAAP gross margins of 89% in Q3 2025. High-growth AI-focused players like Astera Labs also command premium margins, reporting 76.2% GAAP gross margin in Q3 2025. This contrasts with more diversified manufacturers facing cyclical headwinds, where margins can be more moderate or compressed. The economic logic behind high margins is tied to proprietary intellectual property and exposure to high-value markets.
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Capital allocation strategies reflect companies' priorities. Growth-oriented players are using cash for technology acquisitions to solidify leadership in key markets like automotive and the intelligent edge. NXP Semiconductors exemplifies this focus on strategic growth through its series of acquisitions totaling over $1.3 billion in 2025, including TTTech Auto, Aviva Links, and Kinara, Inc. More mature companies with strong cash flow are prioritizing shareholder returns through significant buybacks, as demonstrated by Marvell Technology's new $5 billion stock repurchase program authorized in September 2025.
The industry's financial health is generally robust, enabling strategic flexibility. NXP Semiconductors, for instance, maintains total liquidity of nearly $6 billion, including a $2.5 billion revolving credit facility, allowing it to fund significant acquisitions while managing its net debt, which stood at $8.28 billion in Q3 2025. Valens Semiconductor stands out with no debt, further highlighting the varied but generally strong balance sheet positions across the sector.
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