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All Stocks (10)

Company Market Cap Price
TSM Taiwan Semiconductor Manufacturing Company Limited
TSMC operates as a pure-play semiconductor foundry, fabricating silicon wafers for fabless chip companies.
$1.43T
$275.07
-0.87%
INTC Intel Corporation
Foundries represents Intel Foundry Services to manufacture silicon for external customers.
$151.01B
$34.50
NOC Northrop Grumman Corporation
Northrop Grumman operates a semiconductor foundry producing specialized microchips for national security.
$81.14B
$566.72
+0.00%
GFS GLOBALFOUNDRIES Inc.
GlobalFoundries' core business is wafer fabrication services for third-party chip designers, i.e., foundries.
$18.78B
$33.99
+5.44%
UMC United Microelectronics Corporation
UMC operates as a global pure-play wafer foundry, directly manufacturing semiconductors for third-party designers.
$18.14B
$7.24
+1.62%
MTSI MACOM Technology Solutions Holdings, Inc.
Foundry capabilities for III-V/compound semiconductors (via MESC, RTP fab transfer and capacity expansion) support manufacturing of high-frequency devices.
$11.79B
$158.31
+0.03%
TSEM Tower Semiconductor Ltd.
Tower operates as an independent semiconductor foundry with global fabs and cross-qualification across multiple process flows.
$10.42B
$93.67
+2.25%
QUBT Quantum Computing, Inc.
AZ Chips is a dedicated photonic chip foundry; QUBT provides foundry services for TFLN photonic integrated circuits to external customers.
$1.63B
$10.18
-0.93%
SKYT SkyWater Technology, Inc.
SkyWater is repositioning as a large domestic wafer foundry, highlighted by the Fab 25 acquisition and ramping Wafer Services.
$672.53M
$13.95
+2.88%
AXTI AXT, Inc.
AXTI's manufacturing model and focus on wafer substrates resembles a foundry-like operation for semiconductor materials.
$411.90M
$8.91
-0.17%

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# Executive Summary The foundry industry is undergoing a profound transformation driven by explosive, near-term demand for AI and High-Performance Computing (HPC), creating a significant performance gap between leading-edge and mature node suppliers. Escalating geopolitical tensions, particularly the U.S.-China tech war, are forcing costly strategic shifts toward supply chain resilience and geographic diversification of manufacturing. Technological leadership in advanced process nodes remains the primary determinant of pricing power and market share, fueling an intense and capital-heavy innovation race. Financial performance is bifurcating, with AI-exposed leaders like Taiwan Semiconductor Manufacturing Company Limited (TSM) seeing robust revenue growth and high margins, while others navigate pricing pressures or costly turnarounds. Competitive strategies are diverging between leading-edge scale players and highly differentiated specialty foundries that create moats in specific high-growth markets. Immense capital expenditure requirements act as a major barrier to entry and a constant pressure on balance sheets, demanding disciplined capital allocation. ## Key Trends & Outlook The primary catalyst reshaping the foundry industry is the explosive demand for AI and High-Performance Computing. Industry giants like Meta Platforms, Microsoft, and Alphabet are collectively planning to invest over $250 billion in AI infrastructure between 2025 and 2026, directly fueling an unprecedented need for advanced semiconductors. This demand translates directly into significant revenue and pricing power for foundries capable of producing these complex chips. Market leader TSM is a prime beneficiary, forecasting a 30% revenue growth in 2025, with its AI accelerator revenue expected to double. The urgency is so high that TSM is accelerating its 2nm production schedule by several quarters to meet this surging demand. Escalating U.S.-China trade tensions, including the potential revocation of waivers for global chipmakers with plants in China, are forcing the industry to de-risk its highly concentrated supply chain. In response, major foundries are undertaking multi-billion dollar geographic diversification projects to provide customers with more secure and politically stable manufacturing options. TSM's strategic global expansion, including its "giga fab cluster" in Arizona, is a direct response to these geopolitical risks and customer needs for geographic flexibility. This trend benefits companies with an established, diversified footprint, which serves as a key competitive advantage, as exemplified by GLOBALFOUNDRIES Inc.'s (GFS) manufacturing presence across the U.S., Europe, and Asia. The key opportunity lies in enabling the AI revolution, not just at the leading edge but also through specialized technologies like silicon photonics that are critical for next-generation data centers. The primary risk is a misstep in the high-stakes race for technological leadership, where a delay or yield issue in a new node, such as Intel Corporation's (INTC) 18A process, can result in significant market share loss and poor returns on billions in capital investment. This intense competition for technological leadership, coupled with the high capital expenditure and R&D intensity required, defines the industry's competitive landscape. ## Competitive Landscape The foundry market is highly concentrated, with Taiwan Semiconductor Manufacturing Company Limited (TSM) controlling roughly 62% of the global chip market. This dominance is a testament to its core strategy of investing billions in R&D and capital expenditure to stay one to two generations ahead in leading-edge logic process technology. By doing so, TSM has become the indispensable manufacturing partner for designers of the world's most advanced chips, including CPUs, GPUs, and mobile SoCs. This approach commands premium pricing, captures the highest-value markets like AI and HPC, and benefits from immense economies of scale, creating a deep competitive moat. TSM's success is evident in 74% of its wafer revenue coming from nodes 7nm and below. However, this strategy carries significant financial risk if a technology node is delayed or has poor yields, and its high concentration of manufacturing in Taiwan creates geopolitical vulnerability. In contrast, other firms have built successful models by avoiding the leading-edge race and focusing on differentiated specialty technologies for markets like automotive, IoT, RF, and power management. This strategy allows foundries to develop highly-differentiated, feature-rich process technologies that cater to specific customer needs. GLOBALFOUNDRIES Inc. (GFS) exemplifies this approach, focusing on its 22FDX platform and RF-SOI technologies for high-growth markets such as automotive and edge AI. This specialization has resulted in over 90% of GFS's recent design wins being sole-sourced, indicating strong customer reliance and a robust competitive moat in its chosen niches. While this model typically involves lower capital intensity than leading-edge competition, the addressable market for any single specialty technology is smaller. A third approach involves achieving near-monopolistic control over a specific enabling technology, such as silicon photonics for data centers. Tower Semiconductor Ltd. (TSEM) has successfully pursued this strategy, focusing its R&D and manufacturing expertise to become the undisputed leader in Silicon Photonics (SiPho). With an estimated 80% market share in SiPho, TSEM has become a crucial enabler for the high-speed optical interconnects required in AI clusters. This niche dominance allows TSEM to become a critical, sole-source supplier to key players, providing significant pricing power and a strong moat within that specific segment. However, this model carries the vulnerability of over-reliance on a single technology or end-market and the risk of disruption by alternative technologies. Ultimately, the key competitive battlegrounds are the intense TSM-Intel race at the leading edge for advanced process nodes and the fight for sole-sourced design wins in highly specialized markets. ## Financial Performance Revenue growth in the foundry industry is sharply bifurcating, driven almost entirely by a company's exposure to the AI and HPC markets versus headwinds in other segments like automotive or delayed government programs. Leaders are those directly supplying the AI buildout, while laggards are facing inventory corrections or contract delays in non-AI markets. TSM's projected 30% revenue growth for full-year 2025 exemplifies the powerful AI tailwind, with its AI accelerator revenue expected to double. In stark contrast, SkyWater Technology, Inc. (SKYT) experienced a 37% year-over-year decline in revenue in Q2 2025, reflecting the impact of headwinds such as U.S. government funding delays and oversupply challenges faced by a key automotive customer. {{chart_0}} Profitability shows a clear divergence based on technological leadership and business model. Gross margins range from nearly 60% down to 25%, with some segments experiencing deep operating losses. This divergence is driven by pricing power; technology leaders at the cutting edge command premium margins for their performance advantages. TSM's 58.6% gross margin in Q2 2025 is clear proof of the pricing power that comes with technological supremacy and its dominant position in advanced nodes. In contrast, companies undertaking massive technology investments, like Intel, are incurring significant near-term losses to fund their comeback. Intel Foundry's operating margin of -72.0% in Q2 2025 illustrates the immense cost of trying to catch up and regain technological leadership. {{chart_1}} The dominant theme in capital allocation is aggressive investment in technology and capacity to capture future growth, balanced in some cases with financial restructuring. Companies are allocating massive amounts of capital to R&D and new fabrication facilities, driven by the AI opportunity and the need for geographic diversification. For companies in transition, this is coupled with strategic deleveraging by divesting non-core assets to fund these critical investments. Intel's plan for approximately $18 billion in gross capital investment for 2025, while simultaneously divesting assets like its NAND business ($1.9 billion) and a 51% stake in Altera ($4.4 billion net cash proceeds expected), perfectly encapsulates this dual strategy of investing to compete while streamlining the balance sheet. The industry's financial health is generally strong but mixed, characterized by large cash reserves for leaders and significant debt for those in investment cycles. The state of the balance sheet is a direct outcome of a company's profitability and capital intensity. Market leaders with high margins generate enormous cash flows, creating fortress-like balance sheets. TSM's $90 billion in cash and marketable securities as of Q2 2025 is the clearest indicator of the financial strength derived from sustained market leadership and robust cash generation from operations. {{chart_2}}
GFS GLOBALFOUNDRIES Inc.

GlobalFoundries and Navitas Forge Strategic GaN Partnership to Accelerate U.S. AI and Power Applications

Nov 21, 2025
SKYT SkyWater Technology, Inc.

SkyWater Technology Partners with Silicon Quantum Computing to Accelerate Hybrid Quantum‑Classical Systems

Nov 20, 2025
TSM Taiwan Semiconductor Manufacturing Company Limited

Taiwan Prosecutors Probe Former TSMC Executive Lo Wei‑jen Over Alleged 2nm Technology Theft

Nov 20, 2025
GFS GLOBALFOUNDRIES Inc.

GlobalFoundries Partners with BAE Systems to Deliver Radiation‑Hardened 12‑nm FinFET Chips for Space Applications

Nov 19, 2025
GFS GLOBALFOUNDRIES Inc.

GlobalFoundries Acquires Singapore's Advanced Micro Foundry to Expand Silicon Photonics Capabilities

Nov 18, 2025
INTC Intel Corporation

Graid Technology Secures Licensing Deal with Intel for Virtual RAID on CPU (VROC)

Nov 18, 2025
TSM Taiwan Semiconductor Manufacturing Company Limited

Defiance Launches 2X Short ETF Targeting Taiwan Semiconductor Manufacturing Company

Nov 18, 2025
QUBT Quantum Computing, Inc.

Quantum Computing Inc. Unveils Neurawave Photonics‑Based Reservoir Computer Ahead of SuperCompute25

Nov 17, 2025
TSEM Tower Semiconductor Ltd.

Tower Semiconductor Unveils SW2001, a 12‑V to 1‑V High‑Efficiency Buck Regulator

Nov 17, 2025
QUBT Quantum Computing, Inc.

Quantum Computing Inc. Reports Q3 2025 Earnings: Revenue 280% YoY, EPS Meets Expectations

Nov 15, 2025
GFS GLOBALFOUNDRIES Inc.

GlobalFoundries Beats Q3 2025 Earnings Estimates, Projects Strong Q4 Guidance

Nov 13, 2025
GFS GLOBALFOUNDRIES Inc.

GlobalFoundries Beats Q3 2025 Earnings Estimates, Highlights Margin Expansion and Strong Guidance

Nov 12, 2025
TSEM Tower Semiconductor Ltd.

Tower Semiconductor Unveils 300‑mm Wafer‑Bonding 3D‑IC Platform for Co‑Packaged Optics

Nov 12, 2025
QUBT Quantum Computing, Inc.

Quantum Computing Inc. Partners with POET Technologies to Build 3.2 Tbps Optical Engines

Nov 11, 2025
GFS GLOBALFOUNDRIES Inc.

GlobalFoundries Secures GaN Technology License from TSMC to Expand U.S. Power Electronics Portfolio

Nov 10, 2025
TSEM Tower Semiconductor Ltd.

Tower Semiconductor Reports Q3 2025 Earnings: Revenue $395.7 M, EPS $0.55, Record Q4 Guidance

Nov 10, 2025
TSM Taiwan Semiconductor Manufacturing Company Limited

Nvidia CEO Seeks Additional Chip Supply from TSMC to Meet AI Demand Surge

Nov 08, 2025
MTSI MACOM Technology Solutions Holdings, Inc.

MACOM Reports Fiscal Q4 2025 Results: Adjusted EPS Beats Estimates, Revenue Slightly Below Forecast

Nov 06, 2025
SKYT SkyWater Technology, Inc.

SkyWater Technology Reports Record Q3 2025 Revenue and Strong Margin Expansion, Non‑GAAP EPS Beats Expectations

Nov 06, 2025
INTC Intel Corporation

Intel Launches COMX‑A300 Edge AI Computing Module

Nov 05, 2025
MTSI MACOM Technology Solutions Holdings, Inc.

MACOM Secures Licensing Deal to Produce HRL’s 40 nm GaN‑on‑SiC Process

Nov 05, 2025
GFS GLOBALFOUNDRIES Inc.

GlobalFoundries Expands Partnership with Silicon Labs to Manufacture Next‑Generation Wireless SoCs in U.S.

Oct 30, 2025
GFS GLOBALFOUNDRIES Inc.

GlobalFoundries CFO John Hollister Resigns; Sam Franklin Named Interim CFO

Oct 28, 2025
INTC Intel Corporation

Intel Partners with TurinTech to Deliver Offline AI PC Solution

Oct 25, 2025

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